ProCell Laser Weld. Innovative welding of wires without solder paste.
Direct soldering of wires on PCBA boards.
Using patented pulsed laser technology.
Outstanding productivity and highest quality with 100% process stability.
Inline full automation.
Execution in microseconds.
State-of-the-art technologies enable an impressive processing speed.
Absolutely process-reliable.
No manual welding or operation required. Guaranteed no problems with poor soldering quality.
Patented solution.
Unique technology and process.
Our laser cell for efficient wire soldering of PCBs and PCBAs—even for demanding tasks. The combination of leading technologies from Schnaidt and TRUMPF Laser offers an outstanding solution for a wide range of applications based on industry-proven technology.
Technical DataTechnological quantum leap.
Compared to conventional strand soldering processes, laser soldering enables a significant increase in process quality and efficiency.
Wire soldering without solder paste.
Advanced laser technologies and process innovations are paving the way for an innovative and new way of attaching wires to electronic circuit boards.
Simple set-up, simple operation.
Technical Data
At a glance.
Beam quality
< 1,5 M²
Wavelength
355 mm
Pulse sequence frequency
1 kHz – 120 kHz
Minimum focal diameter
16 µm at focal length 330 mm
Maximum internal focus position control
± 30 mm at focal length 330 mm
Maximum text field size
220 x 220 mm at focal length 330 mm
Contact
Contact us for detailed information or individual solutions.
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